The IDTechEx report titled “Antenna in Package (AiP) for 5G and 6G 2024-2034” discusses the growth of mmWave technology in mobile communications, highlighting the need for advancements in packaging solutions. It provides insights into substrate materials and packaging methods, covering the challenges of integrating antennas for future networks. The report underscores the importance of cost, miniaturization, and performance in developing effective AiP technologies.
The report “Antenna in Package (AiP) for 5G and 6G 2024-2034” by IDTechEx explores the evolution of mmWave technology transitioning from military and automotive uses to mobile communications, enabling data speeds of up to 20 Gbps and latencies as low as 1 ms. To support this growth, significant advancements in RF components, low-loss materials, and semiconductor packaging are essential, with particular emphasis on innovative packaging solutions.
IDTechEx’s report highlights various AiP technologies that cater to 5G mmWave and future 6G networks. It analyzes a range of substrate materials, including organic and LTCC, as well as packaging techniques like flip-chip and fan-out. The focus is on material properties, manufacturing feasibility, and supply chain dynamics, along with insights into antenna integration beyond 100 GHz, addressing the sector’s current challenges.
The key trend in antenna packaging is towards enhanced integration, as AiP technology allows antennas to be compactly embedded within semiconductor packages. Unlike traditional antennas, this integration leads to improved performance and reduced footprints, critical for consumer devices. Research continues on packaging technologies for sub-THz applications in 6G, yet manufacturing challenges linger, keeping many innovations in the research phase.
For successful AiP technology deployment, cost-effectiveness is paramount, with a target pricing of $2 for a 1×1 module being crucial for adoption. While economies of scale can lower prices, initial affordability remains a hurdle. Equally important is miniaturization, particularly for integration in sleek devices like smartphones, where size directly impacts performance.
High performance, signal integrity, and reliability in AiP modules are also vital. This entails the integration of high-gain antenna arrays and thermal management to dissipate heat effectively. Scalability provides the flexibility to adapt modules for various applications, ensuring that the necessary considerations—antenna choice, substrate materials, and integration of passive components—are thoroughly examined in detail.
The report by IDTechEx emphasizes that significant advancements in antenna packaging technologies like AiP are crucial for supporting the demands of 5G mmWave and future 6G networks. Key considerations include cost-effectiveness, miniaturization, high performance, and reliability. Understanding these factors will be vital for companies engaging in high-frequency telecommunications as they navigate the evolving landscape of antenna integration.
Original Source: www.idtechex.com
